| General information |
| Type | CPU / Microprocessor |
| Market segment | Mobile |
| Family | AMD Phenom II Quad-Core Mobile |
| Model number ? | N930 |
| CPU part number | HMN930DCR42GM is an OEM/tray microprocessor |
| Stepping codes | AADHC AD NADHC AD |
| Frequency ? | 2000 MHz |
| Bus speed ? | One 1800 MHz 16-bit HyperTransport link |
| Clock multiplier ? | 10 |
| Package | 638-pin micro-PGA |
| AMD Package numbers | 30600, 30605 |
| Socket | Socket S1 (S1g4) |
| Size | 1.38" x 1.38" / 3.5cm x 3.5cm |
| Weight | 0.2oz / 5.7g |
| Introduction date | May 12, 2010 |
| |
| Architecture / Microarchitecture |
| Microarchitecture | K10 |
| Platform | Danube |
| Processor core ? | Champlain |
| Core stepping ? | BL-C3 |
| CPUID | 100F53 |
| Manufacturing process | 0.045 micron SOI |
| Data width | 64 bit |
| The number of cores | 4 |
| The number of threads | 4 |
| Floating Point Unit | Integrated |
| Level 1 cache size ? | 4 x 64 KB instruction caches
4 x 64 KB data caches |
| Level 2 cache size ? | 4 x 512 KB |
| Cache latency | 3 (L1 cache)
15 (L2 cache) |
| Multiprocessing | Uniprocessor |
| Features | - MMX technology
- 3DNow!
- SSE
- SSE2
- SSE3
- SSE4A ?
- AMD64 technology ?
- Enhanced Virus Protection ?
- Virtualization technology ?
|
| Low power features | PowerNow! |
| On-chip peripherals | - Integrated DDR3 SDRAM memory controller
- HyperTransport technology 3.0
|
| |
| Electrical/Thermal parameters |
| Thermal Design Power ? | 35 Watt |
| |
| Notes on AMD HMN930DCR42GM |
- The fastest supported memory is DDR3-1333
|
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